Liquid crystal display (lcd)

ABSTRACT

A liquid crystal display (LCD) is provided that comprises a rearward LCD substrate sheet that has an array of vias formed, where the vias provide electrical conduction between both sides of the rearward LCD substrate sheet. The number of vias in the array is substantially equal to or at least equivalent to a combination of a number of column drive lines and a number of row drive lines. The respective drive lines are connected to a corresponding via, such as on one side of the rearward LCD substrate sheet, and respective patterned conductors are connected to a corresponding via, such as on the other side of the rearward LCD substrate sheet. The patterned conductors provide a connection between respective drive lines and one or more corresponding drivers. In one example, this allows a “full bleed” display to be generated.

BACKGROUND

A liquid Crystal Display (LCD) is a thin, flat dynamic display that usesliquid crystals (LCs) to modulate light emitted from a light source,typically from a backlighting component. LCDs are widely used in avariety of applications including: televisions, monitors (e.g., computermonitors), device instrument panels (e.g., clocks, games, calculators,and detectors), vehicle displays, telephones, portable media players,signage, etc. They are particularly useful in small consumerelectronics, but have also found great commercial success in largedisplay systems. LCDs have displaced cathode ray tube (CRT) displays inmost applications, as they are usually more compact, lightweight,portable, and affordable.

To provide a general background, LCDs systems typically comprise abacklighting unit, comprising cold cathode fluorescent lights (CFLs) orlight emitting diodes (LEDs), which provide the light for the LCD. TheLCD itself often comprises layers of thin film transistors (TFTs),electrodes, capacitors, spacers and liquid crystals (LCs) sandwichedbetween layers of glass or some clear polymer. Further, the “sandwich”can be layered with alignment film that facilitates in modulating (e.g.,aligning) the LCs during operation. Additionally, a matrix layercomprises RGB filters that provide color, and cross axis polarizingfilters are added to the front and back of the LCD to either block orallow light to pass.

SUMMARY

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key factors oressential features of the claimed subject matter, nor is it intended tobe used to limit the scope of the claimed subject matter.

Conventional LCD systems employ backlighting that uses one or more coldcathode fluorescent lights (CFLs) and one or more waveguide plates todistribute light along a back of the LCD. This type of back lightingdesign is disposed in a manner in the system such that it extends beyondthe edges of the LCD, thereby necessitating a cover that extends beyondthe edges of the LCD. Further, driver electronics that provide a signalto the interior surface of the LCD (e.g., to row and column electrodesthat intersect at pixels) have conductors (e.g., wires) that are routedaround the edge of the rear sheet (e.g., glass or polymer sheet layer)to connect with drive lines inside the LCD. Therefore, because theseconductors are exposed around one or more edges of the LCD, a cover orbezel is needed for protection and aesthetics.

Among other things, one or more techniques and/or systems are disclosedthat can be used to create a “full bleed” display, for example, where anentire front surface of an LCD system (e.g., monitor or television)comprises an active display surface, with no bezel or frame. A “fullbleed” display can comprise a display surface that has an active displaysurface from edge to edge. Previously, systems have claimed to be“borderless,” however, these systems merely provide a substantiallyseamless joint between a bezel and a display area. The techniques andsystems, disclosed herein, can provide for seamless (e.g., without bezelor frame) integration of multiple displays, for example, to create atiled display surface of a plurality of “full bleed” displays.

In one embodiment of an LCD, a rearward (e.g., where a front comprises aviewing front of the LCD) LCD substrate sheet comprises an array ofvias, which are formed through the rearward LCD substrate sheet, inorder to provide electrical conduction (e.g., for a signal) between adriver side of the rearward LCD substrate sheet and a drive line side ofthe rearward LCD substrate sheet. A number of vias in the array of viasis substantially equal to or at least equivalent to a combined number ofcolumn drive lines and a number of row drive lines. Respective drivelines are connected to a corresponding via at the drive line side of therearward LCD substrate sheet; and respective patterned conductors areconnected to a corresponding via at the driver side of the rearward LCDsubstrate sheet. Here, in this example, the patterned conductors areconfigured to connect a drive line to a driver, where multiple drivelines may be connected to the same driver.

To the accomplishment of the foregoing and related ends, the followingdescription and annexed drawings set forth certain illustrative aspectsand implementations. These are indicative of but a few of the variousways in which one or more aspects may be employed. Other aspects,advantages, and novel features of the disclosure will become apparentfrom the following detailed description when considered in conjunctionwith the annexed drawings.

DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are component diagrams illustrating example embodimentsof current liquid crystal display (LCD) system designs.

FIG. 2 is a component diagram illustrating another example embodiment ofa current LCD system design.

FIGS. 3A and 3B are component diagrams of exemplary portions of a LCD.

FIG. 4 is a component diagram illustrating an exemplary embodiment ofone or more portions of an LCD.

FIGS. 5A and 5B illustrate exemplary embodiments of one or more portionsof an LCD.

FIG. 6 is a component diagram illustrating another exemplary embodimentof one or more portions of an LCD.

FIG. 7 is a component diagram illustrating another example embodiment ofone or more portions of an LCD.

FIG. 8 is a flow diagram of an exemplary method for connecting driversto drive lines in an LCD.

FIG. 9 is a flow diagram illustrating an exemplary embodiment of one ormore portions of a method for connecting drivers to drive lines in aLCD.

DETAILED DESCRIPTION

The claimed subject matter is now described with reference to thedrawings, wherein like reference numerals are used to refer to likeelements throughout. In the following description, for purposes ofexplanation, numerous specific details are set forth in order to providea thorough understanding of the claimed subject matter. It may beevident, however, that the claimed subject matter may be practicedwithout these specific details. In other instances, structures anddevices are shown in block diagram form in order to facilitatedescribing the claimed subject matter.

FIGS. 1A and 1B are component diagrams illustrating example embodiments100 and 150 of current liquid crystal display (LCD) system designs. Inthe example embodiment 100 the LCD comprises front 102 and rear 114polarizer film layers. LCDs typically use cross-axis polarized layers toblock or pass light for creating images on the display. A front (facinga viewing front of the LCD) substrate sheet layer 104 and a rearsubstrate sheet layer 112 provide a substrate for internal components ofthe LCD and provide a seal on both sides. Typically, the substrate sheetlayers are comprised of glass or a clear polymer, depending on a sizeand use of the LCD.

A matrix layer 106 can comprise a black matrix film, a color filterpattern, and sometimes a protective film layer. The liquid crystal (LC)layer 108 comprises LCs arranged in a manner so that they align alongalignment films on either side of the LCs. The LC layer 108 alsocomprises spacers, typically made of a clear polymer, that give the LClayer 108 its needed gap for changing an arrangement of the LCs. A driveline layer 110 comprises thin film transistors, horizontal (rows) andvertical (columns) drive lines, pixel capacitors and electrodes. Thislayer 110 is used to drive pixel activation and alignment of the LCs inthe LCD.

The drive lines are connected to driver components 118 at the edge ofthe LCD, as the connection wires 120 are routed around the rear LCDsubstrate sheet layer 112. Typically the driver connection wires 120connect to column drive lines from a top or bottom and to the row drivelines from one side. The routing of the driver connection wires aroundthe substrate sheet layer 112 creates a need for a bezel around LCDmonitors (e.g., TVs, screens, computer monitors) to incorporate andprotect the driver connection wires 120. Recent designs have reduced anamount of space used for these connections; however, there is a limit tothe reduction when using this configuration.

Further, a backlighting component 116 comprises one or more cold-cathodefluorescent lights (CFLs), which may be approximately one eighth of aninch thick in diameter, and run a full length and/r width of thedisplay. The backlighting component 116 can comprise a waveguide platethat provides for light to be distributed along the length and/or widthof the display; a prism sheet that orients the light in a parallelmanner; and an optical diffuser to help create an even distribution forbacklighting. The presence of the CFL lights in this configuration canalso lead to a bezel around the edge of the display, for example, as theCFLs typically need to extend past the edges of the display (e.g., toavoid dark or inactive spots at the edges).

The exemplary embodiment 150 of FIG. 1B illustrates an alternate to theexample 100. In this embodiment 150, instead of a CFL-based lightbacklighting component (e.g., 116 of 100) the example display 150utilizes an array of LEDs 152 to provide backlighting for the LCD.Further, a circuit board 154 (e.g., a printed circuit board (PCB))provides control for the LED array 152. In this example embodiment 150the driver control components 118 are disposed at the back of thecircuit board 154. This design enables the bezel to be smaller than maybe found in the example 100; however, a bezel is still needed to coverthe connection wires 120 from the drivers to the drive line layer 110,and thus neither the embodiment 100 or 150 provide a “full bleed”display.

FIG. 2 is a component diagram illustrating another example embodiment200 of a conventional LCD system design. A drive-line side face (theinside face) of a rear LCD substrate sheet 202 (e.g., comprising glassor a transparent polymer) is shown. In this embodiment 200, column driveline 206 and row drive lines 212 are shown for illustrative purposes;however, typically these components continue across the drive-line faceof the rear LCD substrate sheet 202. Driver connections 204 and 210 arerouted from behind the rear LCD substrate sheet 202, around its edge, tothe drive-line side face. The driver connections 204 and 210 connect at208 and 214 to column drive lines 206 and row drive lines 212,respectively. As described above, routing the driver connections aroundthe edge of the rear LCD substrate sheet 202 necessitates a bezel at therespective edges to cover the driver connectors 204 and 210, thuspreventing a “full bleed” display.

An LCD can be devised that mitigates a need for a bezel around itsedges, for example, thereby providing a “full-bleed” display. A“full-bleed” display comprises a display where the front (viewing face)is an active display surface with no area taken up by a frame of bezelaround the active display area. That is, for example, an entire front ofthe display comprises a viewing screen, such that “full bleed” displayscan be abutted with no non-active viewing area components (e.g., seamscomprising a bezel or frame) between the displays.

FIG. 3A is a component diagram of an exemplary portion of a liquidcrystal display 300 (LCD). A rearward LCD substrate sheet 304 comprisesan array of vias 306 that are formed to provide electrical conductionbetween a driver side 320 of the rearward LCD substrate sheet 304 and adrive line side 322 of the rearward LCD substrate sheet 304. The arrayof vias 306 comprises a number of vias that is substantially equal to orat least equivalent to a combined number of column drive lines and anumber of row drive lines.

For example, as illustrated in the example embodiment 350 of FIG. 3B,the number of vias in the array of vias 306A and 306B corresponds to thenumber of column drive lines 352 and row drive lines 354. Further, inthis embodiment 350, the vias are formed through the rearward LCDsubstrate sheet 304, thereby providing an electrical connection, at 356and 358, between the column drive lines 352 and row drive lines 354,respectively, and the driver side 320 of the rearward LCD substratesheet 304.

The respective drive lines 352 and 354 are connected 356 and 358 to acorresponding via 306 at the drive line side 322 of the rearward LCDsubstrate sheet 304. As an example, drive lines can be comprised in adrive-line layer 302, where the drive lines comprise transparentelectrodes deposited onto the front of the rearward LCD substrate sheet304 in lines that are etched onto the sheet. The drive lines conduct asignal from the drivers 312 to respective pixels (not shown) at anintersection of a row drive line 354 and a column drive line 352. Inthese embodiments 300, 350 the drive lines 352, 354 are connected, at356 and 358, to the vias 306 instead of driver connections coming aroundthe rearward LCD substrate sheet 304 (e.g., as shown in FIGS. 1A, 1B and2), thus providing an efficient LCD driver connection that allows for,among other things, a “full bleed” display.

Further, a patterned conductor 308 (e.g., a driver connection) isconnected to a corresponding via 306 at the driver side 320 of therearward LCD substrate sheet 304, for the respective vias 306.Respective patterned conductors 308 connect the drive lines 352 and 354to a driver 312, using the vias 306, to provide signal conductionbetween the drive line side 322 and the driver side 320. In oneembodiment, a patterned conductor (e.g., 308) comprises an electrode(e.g., wire) that is deposited in a pattern corresponding to a desiredconnection.

For example, a PCB (e.g., 310) can comprise circuitry configured tocontrol components and functions of the LCD, such as the drivers andbacklighting. In this example, the patterned conductors can be depositedonto the PCB in an array corresponding to the array of vias. Further, asan example, the patterned conductors 308 can comprise any material thatconducts signals, such as from the drivers 312 to the vias 306, such ascopper wire, or a transparent electrode (e.g., transparent conductingoxides, or carbon nanotube conductors). Additionally, respectivepatterned conductors 308 may be connected to one driver control, orseveral patterned conductors may be connected to a driver control array,for example; and there may be a plurality of driver control arrays.

FIG. 4 is a component diagram illustrating an exemplary embodiment 400of one or more portions of an LCD. In this embodiment 400, an opticaldiffuser 420 comprises an array of holes that align with the array ofvias 306. The array of holes in the optical diffuser 420 can provideaccess for the patterned conductors 308 to connect to the vias 306. Forexample, the optical diffuser 420 can have a same arrangement of holesas is formed for the array of vias 306, such as shown in FIG. 3B, and/oris formed for the array of patterned conductors 308. In this way, thepatterned conductors 308 will be able to connect to the vias 306 throughthe optical diffuser 420.

In this embodiment 400, a light source 422 (e.g., an array of LEDs) isdisposed between the drivers 312 and the rearward LCD substrate sheet304. Further, the light source 422 is disposed entirely within afootprint formed by the rearward LCD substrate sheet 304. For example,as described above, the light source can comprise an array of LEDscontrolled by the circuit board 310. The light source 422 may compriseseveral components that provide for light from the LEDs to be directedtoward the LCD and diffused appropriately across the LCD, for example.Additionally, in this embodiment, in order to mitigate a need for abezel or frame around the LCD, the light source 422 fits entirely withinthe area of the LCD (e.g., does not extend beyond the edges of the LCD).

FIGS. 5A and 5B illustrate exemplary embodiments 500 and 550 of one ormore portions of an LCD. In the exemplary embodiment 500 of FIG. 5A, thevias comprise a hole 512 formed through the rearward LCD substrate sheet502, where the conductive material 504 is coating a sidewall of the hole512 and filling the hole. In this embodiment, for example, a drive line506 (e.g., column or row drive line) can be deposited on the rearwardLCD substrate sheet 502 such that it contacts the conductive material504 of the via. Further, the patterned conductor 508 can be connected tothe conductive material 504 of the via, for example, to provideconnection to the driver 510.

In another embodiment 550 of FIG. 5B, the vias comprise a hole 562formed through the rearward LCD substrate sheet 552, and the conductivematerial 554 merely coats the sidewall of the hole 562 and does not fillthe hole. In this embodiment, for example, the drive line 556 can bedeposited on the rearward LCD substrate sheet 502 such that it contactsthe conductive material 554 of the via. Further, the patterned conductor558 can be connected to the conductive material 554 of the via, forexample, to provide connection to the driver 560. In this way, in thisexample, the via provides for signal conduction between both sides ofthe rearward LCD substrate sheet 552, for example, and a seal is alsomaintained between both sides.

In one embodiment, the coating of the sidewall of the respective viascan comprise a transparent conducting film (TCF). For example, TCFs caninclude transparent conducting oxides, such as indium tin oxide (ITO),aluminum doped zinc oxide (AZO), and fluorine doped tin oxide (FTO); andcan include conductive polymers. Further, in one embodiment, metallicconductive coatings may be used for the vias. For example, a copper (orsome other conductive metal, or metal-based material) film may beapplied (e.g., deposited) to the sidewalls of the holes to form thevias.

In one aspect, a length of a drive line (e.g., 352, 354 of FIG. 3B) canaffect signal delay, particularly for large LCDs (e.g., large monitorsor televisions using large LCDs). For example, the drive lines aretypically less than desirable signal conductors, and a signal travellingfrom the driver connection (e.g., at an edge) along a full length (e.g.,across a width or length) of the drive line may experience signal delay.In this aspect, current LCDs can employ merely two drive lines percolumn or row (e.g., one drive line connected from each side), as thedriver connections are routed around the rear LCD sheet layer, asdescribed in FIGS. 1A, 1B and 2.

Given the configuration provided herein, however, in one embodiment, twoor more column vias can be used per display column, with respectivecolumn vias connected to a column driver. Further, two or more row viascan be used per display row, with respective row vias connected to a rowdriver. Further, in one embodiment, the two or more vias per displaycolumn can be connected to two or more column drive lines per displaycolumn; and the two or more vias per display row can be connected to twoor more column drive lines per display row.

FIG. 6 is a component diagram illustrating another exemplary embodiment600 of one or more portions of an LCD. In this embodiment 600, therearward LCD substrate sheet 602 comprises several sets of column vias604A, 604B, 604C, for example, where the respective display columnscomprise three vias (e.g., one of 604A, one of 604B and one of 604C perrespective display column). The respective vias 604 are connected tocolumn drive lines 608A, 608B, 608C, for example, where the respectivedisplay columns comprise three drive wires (e.g., of shorter length thana full length drive line).

Further, the rearward LCD substrate sheet 602 comprises several sets ofrow vias 606A, 606B, 606C, for example, where the respective displayrows comprise three vias. The respective vias 606 are connected to rowdrive lines 610A, 610B, 610C, where the respective display rows comprisethree drive wires. In this way, for example, each via can be connectedto a driver (e.g., one per driver, one set of column or row vias to adriver, and/or a plurality of vias connected to a driver control array),and a signal delay can be mitigated as the respective drive lines areshorter.

Additionally, it will be appreciated that the example embodiment 600 ismerely an illustrative example, and that a plurality of sets of vias maybe employed. For example, respective display columns and/or display rowsmay comprise four or more vias and four or more corresponding drivelines per column/row. In this example, the additional vias percolumn/row can shorten the drive lines even more, thereby providing forimproved signal delay (e.g., providing a quicker refresh rate for theLCD).

FIG. 7 is a component diagram illustrating another example embodiment700 of one or more portions of an LCD. In this embodiment, the rearwardLCD substrate sheet 710 can comprise an array of column ridges 702 thatare formed on the drive line side of the rearward LCD substrate sheet710. In one embodiment, the respective column ridges 702 are alignedwith a corresponding column via 712. A column ridge 702 can provide asubstrate location for a patterned connection 704 to pierce an alignmentfilm 708 that is coated on the drive line side of the rearward LCDsubstrate sheet 710. In this embodiment, this arrangement can provide aconnection between the column via 712 and a corresponding column driveline 706.

The patterned conducting connector 704 is disposed along respectivecolumn ridges 702, for the rearward LCD substrate sheet 710, connectingthe column via 712 with the corresponding column drive line 706 throughthe alignment film 708. In this way, for example, there is a connectionbetween the column drive line 706 and a patterned connection 714, whichconnects to the driver, through the alignment film 708.

A method may be devised for manufacturing an LCD, for example, which mayprovide for a “full bleed” display that comprises a faster refresh rate.FIG. 8 is a flow diagram of an exemplary method 800 for connectingdrivers to drive lines in a liquid crystal display (LCD). The exemplarymethod 800 begins at 802 and involves forming a number of holes througha rearward LCD substrate sheet, at 804, where the number of holes issubstantially equal to or at least equal to a combined number of columndrive lines and a number of row drive lines. For example, if a number orcolumn drive line comprises one thousand and eighty and a number of rowdrive lines comprises one thousand nine hundred and twenty, the numberof holes formed in the rearward LCD substrate sheet can comprise threethousand. In one example, the holes can be formed utilizing femtosecondlaser ablation and/or with a chemical milling process.

At 806, a sidewall of the respective holes is coated with a conductivematerial in order to create an array of vias through the rearward LCDsubstrate sheet. For example, a sidewall can be coated with atransparent conducting film, or a metallic conducting material to createa via that provides signal conduction between both sides of the rearwardLCD substrate sheet. The techniques, described herein, are not limitedto any particular coating method, and it is anticipated that thoseskilled in the art may devise various techniques for coating thesidewalls of the holes to create vias. For example, the coating materialmay be deposited on a surface of the rearward LCD substrate sheet andallowed to flow (or be forced) through the holes.

At 808, respective vias are connected to a driver using patternedconductors, and respective drive lines are connected to a correspondingvia, at 810. For example, after the vias are formed, the drive lines(e.g., both for a display column and display row) can be deposited, suchas by depositing a transparent electrode along grooves etched in a frontof the rearward LCD substrate sheet. In this example, the drive linescan be deposited such that they contact the corresponding via, which canbe aligned along a groove for the drive lines. Further, in oneembodiment, the patterned conductors can have a first connection to thedriver(s), such as through a circuit board, and a second connection canbe made at corresponding vias.

Having connected the patterned conductors and drive lines to the vias,such as to provide a connection between the patterned conductors anddrive lines, the exemplary method 800 ends at 812.

FIG. 9 is a flow diagram illustrating an exemplary embodiment 900 of oneor more portions of a method for connecting drivers to drive lines in aLCD, such as to create a “full bleed” display that has improved refreshrates, for example. At 902, holes are formed in a rearward LCD substratesheet, into a pattern that corresponds to respective column drive linesand row drive lines. That is, for example, the holes in the substratesheet can comprise a pattern that aligns with the drive lines, such asin a path of the drive lines (e.g., as in FIGS. 3B and 6).

In one embodiment, a plurality of holes can be formed for respectivedisplay columns and/or for respective display rows. For example, inorder to have more than one drive line per column and/or row, more thanone hole is formed for each of the display columns and/or display rows.In this way, for example, respective drive lines can be shortened, suchas to provide for a faster refresh rate, where each drive line in a rowor column connects to a driver.

At 904, an array of column ridges are formed on the drive line side ofthe rearward LCD substrate sheet. In this embodiment, respective columnridges are formed so that they align with a corresponding column via. Inthis way, a bonding substrate can be provided for a patterned connection(e.g., along the ridge), in order to pierce an alignment film that iscoated on the drive line side of the rearward LCD substrate sheet. Inthis way, in this embodiment, a connection can be made between thecorresponding column via and a corresponding column drive line (e.g., asin FIG. 7).

At 906, the sidewalls of the holes formed in the rearward LCD substratesheet can be coated with a conductive material (e.g., TCF) to form vias,which provide for conducting a signal from one side of the rearward LCDsubstrate sheet to the other (e.g., instead of going around the rearwardLCD sheet). In one embodiment, coating of the sidewall of a hole to forma via can comprise filling the hole. In another embodiment, the coatingof the sidewall to form a via may not fill the hole.

At 908, appropriate pixel electrodes, capacitors, and/or thin filmtransistors (TFTs), for example, can be deposited on the front of therearward LCD substrate sheet (e.g., to form pixels). At 910, row drivelines are deposited on the front of the rearward LCD substrate sheet,where respective row drive lines are connected to corresponding vias. Asdescribed above, in one embodiment, two or more vias can be connected totwo or more row drive lines per display row.

At 912, a patterned conducting connection is connected to the column viausing the corresponding column ridge. That is, for example, thepatterned conducting connection can be deposited along the ridge for acolumn, where it contacts the corresponding column via. In this way, thepatterned conducting connection can provide a connection to acorresponding column drive line. At 914, column drive lines aredeposited on the front of the rearward LCD substrate sheet, whererespective column drive lines are connected to corresponding vias usingthe patterned conducting connection deposited along the ridges. Asdescribed above, in one embodiment, two or more vias can be connected totwo or more column drive lines per display column.

At 916, an alignment film can be deposited on the front of the rearwardLCD substrate sheet. As described previously, the alignment film can beused to help in aligning the liquid crystals (LCs). Further, the columnridges are formed to pierce the alignment film in order to provide theconnection between the column drive line and the corresponding via,through the patterned conducting connection deposited along the ridge.

At 918, an array of holes can be formed in an optical diffuser, wherethe array of holes align with the holes (vias) in the rearward LCDsubstrate sheet. The array of holes in the optical diffuser allow forthe patterned conductors, which connect the drivers to the vias, to passthrough the optical diffuser. In this way, for example, the opticaldiffuser can be disposed between a circuit board, comprising thepatterned conductors, and the rearward LCD substrate sheet. As describedabove, the optical diffuser can be used to provide an even distributionof backlighting to the LCD from a backlighting component.

At 920, the drivers are connected to the rear (driver side) of therearward LCD substrate sheet by connecting the patterned conductors tocorresponding vias. For example, a driver control array (e.g., driverelectronics) can be disposed on a rear side of a circuit board (e.g.,PCB) and the patterned conductors can be connected to the front sidecircuit board. In one embodiment, as described above, two or more columnvias per display column can be connected to a column driver; and two ormore row vias per display row can be connected to a row driver, such asto provide multiple drive lines per row and/or column.

In this example, the patterned conductors can be attached to the vias,through a lighting component, through the optical diffuser, and attachedto the rear of the rearward LCD substrate sheet. In this way, forexample, the LCD can be formed such that connections between the driversand drive lines do not need to be routed around respective edges of therearward LCD substrate sheet. Further, in one embodiment, thisarrangement can provide for creating a “full bleed” display, where noframing or bezeling is needed around the sides of the LCD display.

Although the subject matter has been described in language specific tostructural features and/or methodological acts, it is to be understoodthat the subject matter defined in the appended claims is notnecessarily limited to the specific features or acts described above.Rather, the specific features and acts described above are disclosed asexample forms of implementing the claims.

As used in this application, the terms “component,” “module,” “system”,“interface”, and the like are generally intended to refer to acomputer-related entity, either hardware, a combination of hardware andsoftware, software, or software in execution. For example, a componentmay be, but is not limited to being, a process running on a processor, aprocessor, an object, an executable, a thread of execution, a program,and/or a computer. By way of illustration, both an application runningon a controller and the controller can be a component. One or morecomponents may reside within a process and/or thread of execution and acomponent may be localized on one computer and/or distributed betweentwo or more computers.

Furthermore, the claimed subject matter may be implemented as a method,apparatus, or article of manufacture using standard programming and/orengineering techniques to produce software, firmware, hardware, or anycombination thereof to control a computer to implement the disclosedsubject matter. The term “article of manufacture” as used herein isintended to encompass a computer program accessible from anycomputer-readable device, carrier, or media. Of course, those skilled inthe art will recognize many modifications may be made to thisconfiguration without departing from the scope or spirit of the claimedsubject matter.

Various operations of embodiments are provided herein. In oneembodiment, one or more of the operations described may constitutecomputer readable instructions stored on one or more computer readablemedia, which if executed by a computing device, will cause the computingdevice to perform the operations described. The order in which some orall of the operations are described should not be construed as to implythat these operations are necessarily order dependent. Alternativeordering will be appreciated by one skilled in the art having thebenefit of this description. Further, it will be understood that not alloperations are necessarily present in each embodiment provided herein.

Moreover, the word “exemplary” is used herein to mean serving as anexample, instance, or illustration. Any aspect or design describedherein as “exemplary” is not necessarily to be construed as advantageousover other aspects or designs. Rather, use of the word exemplary isintended to present concepts in a concrete fashion. As used in thisapplication, the term “or” is intended to mean an inclusive “or” ratherthan an exclusive “or”. That is, unless specified otherwise, or clearfrom context, “X employs A or B” is intended to mean any of the naturalinclusive permutations. That is, if X employs A; X employs B; or Xemploys both A and B, then “X employs A or B” is satisfied under any ofthe foregoing instances. In addition, the articles “a” and “an” as usedin this application and the appended claims may generally be construedto mean “one or more” unless specified otherwise or clear from contextto be directed to a singular form.

Also, although the disclosure has been shown and described with respectto one or more implementations, equivalent alterations and modificationswill occur to others skilled in the art based upon a reading andunderstanding of this specification and the annexed drawings. Thedisclosure includes all such modifications and alterations and islimited only by the scope of the following claims. In particular regardto the various functions performed by the above described components(e.g., elements, resources, etc.), the terms used to describe suchcomponents are intended to correspond, unless otherwise indicated, toany component which performs the specified function of the describedcomponent (e.g., that is functionally equivalent), even though notstructurally equivalent to the disclosed structure which performs thefunction in the herein illustrated exemplary implementations of thedisclosure. In addition, while a particular feature of the disclosuremay have been disclosed with respect to only one of severalimplementations, such feature may be combined with one or more otherfeatures of the other implementations as may be desired and advantageousfor any given or particular application. Furthermore, to the extent thatthe terms “includes”, “having”, “has”, “with”, or variants thereof areused in either the detailed description or the claims, such terms areintended to be inclusive in a manner similar to the term “comprising.”

1. A liquid crystal display (LCD) comprising: a rearward LCD substratesheet comprising an array of vias formed to provide electricalconduction between a driver side of the rearward LCD substrate sheet anda drive line side of the rearward LCD substrate sheet, the array of viascomprising a number of vias substantially equivalent to a combinednumber of column drive lines and a number of row drive lines; drivelines respectively connected to a corresponding via at the drive lineside of the rearward LCD substrate sheet; and patterned conductorsrespectively connected to a corresponding via at the driver side of therearward LCD substrate sheet and configured to connect respective drivelines to a corresponding driver.
 2. The LCD of claim 1, comprising anoptical diffuser comprising an array of holes that align with the arrayof vias, the array of holes configured to provide access for thepatterned conductors to connect to the vias.
 3. The LCD of claim 1, thevias comprising a hole formed through the rearward LCD substrate sheet,and conductive material coating a sidewall of the hole and filling thehole.
 4. The LCD of claim 1, the vias comprising a hole formed throughthe rearward LCD substrate sheet, and conductive material merely coatinga sidewall of the hole and not filling the hole.
 5. The LCD of claim 1,a sidewall of the respective vias coated with one of: a transparentconducting film; and a metallic conducting coating.
 6. The LCD of claim1, comprising: two or more column vias per display column respectivelyconnected to a column driver; and two or more row vias per display rowrespectively connected to a row driver.
 7. The LCD of claim 6,comprising: the two or more vias per display column connected to two ormore column drive lines per display column; and the two or more vias perdisplay row connected to two or more column drive lines per display row.8. The LCD of claim 1, the rearward LCD substrate sheet comprising anarray of column ridges, formed on the drive line side of the rearwardLCD substrate sheet, the column ridges respectively aligned with acorresponding column via and configured to provide for a patternedconnection to pierce an alignment film coated on the drive line side ofthe rearward LCD substrate sheet in order to connect the correspondingcolumn via with a corresponding column drive line.
 9. The LCD of claim8, comprising a patterned conducting connector disposed along respectivecolumn ridges connecting the column via with the corresponding columndrive line through the alignment film.
 10. The LCD of claim 1,comprising a light source disposed between the drivers and the rearwardLCD substrate sheet, the light source disposed entirely within afootprint formed by the rearward LCD substrate sheet.
 11. A method forconnecting drivers to drive lines in a liquid crystal display (LCD),comprising: forming a number of holes substantially equal to a number ofcolumn drive lines and a number of row drive lines through a rearwardLCD substrate sheet; coating a sidewall of respective holes with aconductive material to create an array of vias through the rearward LCDsubstrate sheet; connecting respective vias to a corresponding driverusing patterned conductors; and connecting respective drive lines to acorresponding via.
 12. The method of claim 11, comprising forming theholes in a pattern that corresponds to respective column drive lines androw drive lines.
 13. The method of claim 11, comprising forming an arrayof holes in an optical diffuser that align with the holes in therearward LCD substrate sheet and are configured to provide for thepatterned conductors to pass through the optical diffuser.
 14. Themethod of claim 11, coating the sidewall of respective holes with theconductive material comprising one of: coating the sidewall and fillingthe hole; and coating the sidewall and not filling the hole.
 15. Themethod of claim 11, comprising: respectively connecting two or morecolumn vias per display column to a column driver; and respectivelyconnecting two or more row vias per display row to a row driver.
 16. Themethod of claim 15, comprising: connecting the two or more column viasper display column to two or more column drive lines per display column;and connecting the two or more row vias per display row to two or morerow drive lines per display row.
 17. The method of claim 11, comprisingforming an array of column ridges on the drive line side of the rearwardLCD substrate sheet, the column ridges respectively formed to align witha corresponding column via in order to provide for a patternedconnection to pierce an alignment film coated on the drive line side ofthe rearward LCD substrate sheet to connect the corresponding column viawith a corresponding column drive line.
 18. The method of claim 17,comprising connecting a patterned conducting connection to the columnvia and the corresponding column drive line, using the correspondingcolumn ridge.
 19. The method of claim 11, comprising forming the LCDsuch that no connections between the drivers and drive lines are madearound respective edges of the rearward LCD substrate sheet.
 20. Aliquid crystal display (LCD) comprising: a rearward LCD substrate sheetcomprising: an array of vias, respectively comprising a hole formedthrough the rearward LCD substrate sheet and conductive material coatinga sidewall of the hole, the vias formed to provide electrical conductionbetween a driver side of the rearward LCD substrate sheet and a driveline side of the rearward LCD substrate sheet; the array of viascomprising a number of vias at least equivalent to a combined number ofcolumn drive lines and a number of row drive lines; two or more columnvias per display column respectively connected to a column driver, andtwo or more row vias per display row respectively connected to a rowdriver; the two or more vias per display column connected to two or morecolumn drive lines per display column, and the two or more vias perdisplay row connected to two or more column drive lines per display row;an array of column ridges, formed on the drive line side of the rearwardLCD substrate sheet, the column ridges respectively aligned with acorresponding column via and configured to provide for a patternedconnection to pierce an alignment film coated on the drive line side ofthe rearward LCD substrate sheet in order to connect the correspondingcolumn via with a corresponding column drive line; and a patternedconducting connector disposed along respective column ridges connectingthe column via with the corresponding column drive line through thealignment film; drive lines respectively connected to a correspondingvia at the drive line side of the rearward LCD substrate sheet;patterned conductors respectively connected to a corresponding via atthe driver side of the rearward LCD substrate sheet, and configured toconnect respective drive lines to respective drivers; and an opticaldiffuser comprising an array of holes that align with the array of vias,the array of holes configured to provide access for the patternedconductors to connect to the vias.